|
Format
|
System
|
Main Features
|
Lowest Cure
|
Recommended Processing Method
|
Max Tg1
|
Typical Applications
|
|
Adhesive Film
|
SA 80
|
- Highly toughened resin matrix
- Consistent bond-line thickness and weight
- High strain to failure, high toughness
- Excellent handling and no mixing required
|
12 hrs at 80°C
|
- Autoclave
- Press Moulding
- Vacuum Bagging
|
100°C
|
Co-cure with 80°C prepregs for core and high strength adhesive bonding applications
|
|
Surface Films
|
SF 80
|
- Surface film to generate a resin rich surface
- Suitable for sub-surface applications
|
12 hrs at 80°C
|
- Autoclave
- Press Moulding
- Vacuum Bagging
|
100°C
|
Co-cure with 80°C prepregs for resin rich surface
|
|
SF 96
|
- Pinhole free surface for easy preparation and application of paint system
|
10 hrs at 85°C
|
- Autoclave
- Press Moulding
- Vacuum Bagging
|
115°C
|
Co-cure with 85°C prepregs for resin rich surface ideal for sanding / priming prior to painting
|
|
Intensifying Pastes
|
SP 4832
|
- Co-curable with prepreg systems
- Compatibility of handling and processing
- Ideal for core splicing and gap filling
|
12 hrs at 80°C
|
- Autoclave
- Press Moulding
- Vacuum Bagging
|
100°C
|
Low density, core splicing and gap filling with 80°C prepregs
|
|
SP 9435
|
12 hrs at 85°C
|
96°C
|
Core splicing, prevent bridging and gap filling with 85°C prepregs
|